| 发明名称 |
Wafer, Integrated Circuit Chip and Method for Manufacturing an Integrated Circuit Chip |
| 摘要 |
A wafer has a number of IC areas and a kerf area arranged between the IC areas. The kerf area has a dicing area, a crack stop structure arranged between an IC area and a dicing area, and a trench arranged between the crack stop structure and the dicing area. The crack stop structure includes an extended layer extending beyond the crack stop structure towards the dicing area. |
| 申请公布号 |
US2014264767(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313829582 |
申请日期 |
2013.03.14 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Gratz Achim;Schindelar Thimo |
| 分类号 |
H01L23/544;H01L21/78 |
主分类号 |
H01L23/544 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer, comprising:
a plurality of IC areas; and a kerf area arranged between the plurality of IC areas; wherein the kerf area comprises a dicing area, a crack stop structure arranged between an IC area and the dicing area, and a trench arranged between the crack stop structure and the dicing area; and wherein the crack stop structure includes an extended metal layer extending beyond the crack stop structure towards the dicing area. |
| 地址 |
Neubiberg DE |
