| 摘要 |
The present invention relates to a method for manufacturing an LED module in which a plurality of conductive electrode plates electrically separated from each other are arranged closely to each other on the same plane, insulation layers are laminated on the upper and lower sides of the electrode plates, and a plurality of grounding holes for exposing the electrode plates are formed on one side of the insulation layers so as to ground positive electrodes of LED chips to the separated electrode plates, respectively, thereby enhancing the heat radiation efficiency of the LED module. |
