发明名称 |
SUBSTRATE DEPOSITION SYSTEMS, ROBOT TRANSFER APPARATUS, AND METHODS FOR ELECTRONIC DEVICE MANUFACTURING |
摘要 |
<p>Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.</p> |
申请公布号 |
WO2014143662(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
WO2014US27567 |
申请日期 |
2014.03.14 |
申请人 |
APPLIED MATERIALS, INC |
发明人 |
WEAVER, WILLIAM T.;DANIEL, JR., MALCOLM N.;VOPAT, ROBERT B.;SCHALLER, JASON M.;NEWMAN, JACOB;KANAWADE, DINESH;CONSTANT, ANDREW J.;HICKERSON, STEPHEN C.;HUDGENS, JEFFREY C.;FREEMAN, MARVIN L. |
分类号 |
H01L21/677;B25J9/04;B65G49/07;H01L21/205 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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