MOUNTING SETTING METHOD AND MOUNTING SETTING DEVICE

摘要

Provided is a mounting setting method in which a component mounting device (11) obtains information related to the arrangement position heights of a substrate (16) that comprises a plurality of arrangement positions of differing heights and component size information including the height of a component that is to be arranged, determines the height of a component at an arrangement position from the acquired arrangement position heights and the size of the component, and sets a mounting order for arranging components on the substrate (16) so that a component for which the determined arrangement position height is lower is arranged first. On this occasion, it is determined whether a first component that is attached to a suction head (24) will interfere with a second component that is arranged at an arrangement position, and the mounting order may be set so that the first component is arranged prior to the second component when it is determined that interference will occur.