COUPLED VIAS FOR CHANNEL CROSS-TALK REDUCTION

摘要

Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent vertical transitions is achieved with overlapping metal surfaces within the vertical transitions. In embodiments, one or more of the overlapping metal surfaces are vias, via pads, or metal stub features extending off a vertical transition. In embodiments, signal paths with overlapped vertical transitions are utilized to achieve crosstalk reduction of more than one victim-aggressor pair and/or to achieve crosstalk reduction of more than two aggressors. In embodiments, capacitively coupled vertical transitions are implemented in a package substrate, an interposer, or a printed circuit board.

主权项

1. A plurality of input/output (I/O) signal paths, the signal paths comprising:
a first vertical transition through a thickness of a substrate and associated with a first of the I/O signal paths, wherein the first vertical transition comprises a first metal surface at a first interconnect level, the first metal surface occupying a first area of the substrate adjacent to the first vertical transition; and a second vertical transition through the thickness of the substrate and associated with a second of the I/O signal paths, wherein the second vertical transition comprises a second metal surface occupying a second area of the substrate at a second interconnect level, adjacent to the first interconnect level, and wherein the first and second areas overlap at least partially to occupy a same first overlapped area of the substrate.