| 发明名称 |
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
An electronic device comprising a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire. |
| 申请公布号 |
US2014266533(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414294164 |
申请日期 |
2014.06.03 |
| 申请人 |
CYNTEC CO., LTD. |
发明人 |
Liao Wen-Hsiung;Hsieh Roger;Ikuta Hideo;Chen Yueh-Lang |
| 分类号 |
H01F27/255;H01F41/02 |
主分类号 |
H01F27/255 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device, comprising:
a first magnetic powder; a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is greater than 2, and the first magnetic powder mixes with the second magnetic powder; and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder; wherein the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of conducting wire. |
| 地址 |
HSINCHU TW |
