发明名称 |
DROPLET DISCHARGING HEAD AND IMAGE FORMING APPARATUS |
摘要 |
A droplet discharging head includes a passage substrate in which individual liquid chambers are formed; a plurality of piezoelectric elements formed on the passage substrate; a plurality of wirings for connecting electrodes of the plurality of piezoelectric elements and drive circuit connecting portions for being connected to a drive circuit, respectively, formed on the passage substrate; and a support substrate, formed on the passage substrate, provided with a concave portion for housing the plurality of piezoelectric elements at a surface facing the passage substrate, the support substrate being provided with an opening portion above the drive circuit connecting portions, wherein the support substrate is adhered to the passage substrate at a support substrate adhering region of the passage substrate including area where the wirings are formed, and wherein a wiring space between each adjacent wirings is formed to have a crank portion at the support substrate adhering region. |
申请公布号 |
US2014267499(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201414207910 |
申请日期 |
2014.03.13 |
申请人 |
KATO Masaki |
发明人 |
KATO Masaki |
分类号 |
B41J2/14 |
主分类号 |
B41J2/14 |
代理机构 |
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代理人 |
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主权项 |
1. A droplet discharging head comprising:
a passage substrate in which individual liquid chambers are formed; a plurality of piezoelectric elements formed on the passage substrate; a plurality of wirings for connecting electrodes of the plurality of piezoelectric elements and drive circuit connecting portions for being connected to a drive circuit, respectively, formed on the passage substrate; and a support substrate, formed on the passage substrate, provided with a concave portion for housing the plurality of piezoelectric elements at a surface facing the passage substrate, the support substrate being provided with an opening portion above the drive circuit connecting portions, wherein the support substrate is adhered to the passage substrate at a support substrate adhering region of the passage substrate including area where the wirings are formed, and wherein a wiring space between each adjacent wirings is formed to have a crank portion at the support substrate adhering region. |
地址 |
Tokyo JP |