| 发明名称 |
CHIP ARRANGEMENTS |
| 摘要 |
A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip. |
| 申请公布号 |
US2014264832(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313802848 |
申请日期 |
2013.03.14 |
| 申请人 |
Meyer Thorsten;Barth Hans-Joachim;Mahnkopf Reinhard;Albers Sven;Augustin Andreas;Mueller Christian |
发明人 |
Meyer Thorsten;Barth Hans-Joachim;Mahnkopf Reinhard;Albers Sven;Augustin Andreas;Mueller Christian |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip arrangement, comprising:
a first chip comprising a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip comprising a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip. |
| 地址 |
Regensburg DE |
