发明名称 MEMS ACOUSTIC SENSOR WITH INTEGRATED BACK CAVITY
摘要 A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.
申请公布号 US2014264656(A1) 申请公布日期 2014.09.18
申请号 US201414174639 申请日期 2014.02.06
申请人 InvenSense, Inc. 发明人 ATA Erhan Polatkan;LIM Martin;LI Xiang;LLOYD Stephen;DANEMAN Michael Julian
分类号 B81B7/00 主分类号 B81B7/00
代理机构 代理人
主权项 1. An acoustic sensing device comprising: a structure with a first surface and a second surface attached to a first substrate; wherein the structure is displaced in the presence of an acoustic pressure differential between the first and second surfaces of the structure; wherein the structure is contained in an enclosure formed by the first substrate and a second substrate; wherein the first substrate or the second substrate contains an opening to expose the structure to the environment.
地址 San Jose CA US