发明名称 TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER
摘要 A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.
申请公布号 US2014261978(A1) 申请公布日期 2014.09.18
申请号 US201414292994 申请日期 2014.06.02
申请人 Shin-Etsu Chemical Co., Ltd. 发明人 Furuya Masahiro;Tagami Shohei;Kato Hideto;Ito Hideyuki;Yoshizawa Masahiro
分类号 C09J183/04;H01L21/02 主分类号 C09J183/04
代理机构 代理人
主权项
地址 Chiyoda-ku JP