METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

主权项

1. A semiconductor device, comprising:
a die pad; a die-pad-support lead supporting said die pad, said die-pad-support lead having an end face, and a step reaching to said end face; a semiconductor chip mounted over said die pad, said semiconductor chip having a plurality of bonding pads; a plurality of leads electrically connected with said bonding pads via a plurality of wires, respectively; and a resin-sealing-body sealing said semiconductor chip, said wires and a part of each of said leads, wherein said end face of said die-pad-support lead is exposed from said resin-sealing-body.