| 发明名称 |
CHIP PACKAGE AND METHOD FOR FORMING THE SAME |
| 摘要 |
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface towards the second surface; a second recess extending from a bottom of the first recess towards the second surface, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the second recess together form an exterior side surface of the semiconductor substrate; a wire layer disposed over the first surface and extending into the first recess and/or the second recess; an insulating layer positioned between the wire layer and the semiconductor substrate; and a metal light shielding layer disposed over the first surface and having at least one hole, wherein a shape of the at least one hole is a quadrangle. |
| 申请公布号 |
US2014264785(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414207224 |
申请日期 |
2014.03.12 |
| 申请人 |
XINTEC INC. |
发明人 |
LIN Yi-Min;CHANG Yi-Ming;CHANG Shu-Ming;HO Yen-Shih;LIU Tsang-Yu;CHENG Chia-Ming |
| 分类号 |
H01L23/552;H01L21/48;H01L21/78 |
主分类号 |
H01L23/552 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package, comprising:
a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface towards the second surface; a second recess extending from a bottom of the first recess towards the second surface, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the second recess together form an exterior side surface of the semiconductor substrate; a wire layer disposed over the first surface and extending into the first recess and/or the second recess; an insulating layer positioned between the wire layer and the semiconductor substrate; and a metal light shielding layer disposed over the first surface and having at least one hole, wherein a shape of the at least one hole is a quadrangle. |
| 地址 |
Jhongli City TW |
