MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same

摘要

A method embodiment for forming a micro-electromechanical (MEMS) device includes providing a MEMS wafer, wherein a portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device. A carrier wafer is bonded to the MEMS wafer, and the carrier wafer is etched to expose the first membrane for the microphone device to an ambient environment. A MEMS substrate is patterned and portions of a first sacrificial layer are removed of the MEMS wafer to form a MEMS structure. A cap wafer is bonded to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure. A second sealed cavity and a cavity exposed to an ambient environment on opposing sides of the second membrane for the pressure sensor device are formed.

主权项

1. A method for forming a micro-electromechanical (MEMS) device comprising:
providing a MEMS wafer, wherein a portion of the MEMS wafer is patterned to provide a first membrane for a microphone device and a second membrane for a pressure sensor device; bonding a carrier wafer to the MEMS wafer; etching the carrier wafer to expose the first membrane for the microphone device to an ambient environment; patterning a MEMS substrate and removing portions of a first sacrificial layer of the MEMS wafer to form a MEMS structure; bonding a cap wafer to a side of the MEMS wafer opposing the carrier wafer to form a first sealed cavity including the MEMS structure; and forming a second sealed cavity and a cavity exposed to an ambient environment on opposing sides of the second membrane for the pressure sensor device.