Low Profile Image Sensor

摘要

A sensor package comprising a host substrate with opposing first and second surfaces, an aperture extending therethrough, circuit layers, and first contact pads. A second substrate at least partially in the aperture has opposing first and second surfaces, a plurality of photo detectors, second contact pads at the second substrate first surface and electrically coupled to the photo detectors, and trenches formed into the second substrate first surface, conductive traces extending from the second contact pads and into the trenches. A third substrate has a first surface mounted to the first surface of the second substrate. The third substrate includes a cavity formed into its first surface and positioned over the photo detectors. Electrical connectors connect the first contact pads and conductive traces. A lens module is mounted to the host substrate for focusing light through the third substrate and onto the photo detectors.

主权项

1. An image sensor package, comprising:
a host substrate assembly including:
a first substrate with opposing first and second surfaces,an aperture extending through the first substrate between the first and second surfaces,one or more circuit layers,a plurality of first contact pads electrically coupled to the one or more circuit layers; a sensor chip mounted to the host substrate assembly and disposed at least partially in the aperture, wherein the sensor chip includes:
a second substrate with opposing first and second surfaces,a plurality of photo detectors formed on or in the second substrate,a plurality of second contact pads formed at the first surface of the second substrate which are electrically coupled to the photo detectors,one or more trenches formed into the first surface of the second substrate,a plurality of conductive traces each extending from one of the second contact pads and into the one or more trenches, anda third substrate having a first surface mounted to the first surface of the second substrate, wherein the third substrate includes a cavity formed into the first surface of the third substrate that is positioned over the photo detectors; electrical connectors each electrically connecting one of the first contact pads and one of the plurality of conductive traces; and a lens module mounted to the host substrate assembly, wherein the lens module includes one or more lenses disposed for focusing light through the third substrate and onto the photo detectors.