| 发明名称 |
PROCESSING SYSTEMS, APPARATUS, AND METHODS ADAPTED TO PROCESS SUBSTRATES IN ELECTRONIC DEVICE MANUFACTURING |
| 摘要 |
A via pass-through apparatus is disclosed. The via pass-through apparatus includes a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section of a substrate processing system, the pass-through chamber including an entry and an exit each having a slit valve, and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate at the via location. Systems and methods of operating the system are provided, as are numerous other aspects. |
| 申请公布号 |
US2014263165(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414202763 |
申请日期 |
2014.03.10 |
| 申请人 |
Applied Materials, Inc. |
发明人 |
Hongkham Steve S.;Reuter Paul B.;Englhardt Eric A.;Balasubramanian Ganesh;Chen Xinglong;Rocha-Alvarez JuanCarlos |
| 分类号 |
B01J19/00 |
主分类号 |
B01J19/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A via pass-through apparatus, comprising:
a pass-through chamber adapted to couple between a first mainframe section and a second mainframe section, the pass-through chamber including an entry and an exit each having a slit valve; and a via process chamber located at a different level than the pass-through chamber wherein the via process chamber is adapted to carry out a process on a substrate. |
| 地址 |
Santa Clara CA US |
