| 发明名称 |
INVERTER POWER MODULE PACKAGING WITH COLD PLATE |
| 摘要 |
A heat sink is provided. The heat sink includes a single-piece housing having a floor and two walls, the walls perpendicular to the floor and the walls are parallel to each other. The heat sink includes the housing having an inlet and an outlet. The housing is configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls. The housing is configured to cool the power modules in response to fluid flow into the inlet. |
| 申请公布号 |
US2014262177(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414198329 |
申请日期 |
2014.03.05 |
| 申请人 |
Atieva, Inc. |
发明人 |
TANG Yifan;JAN James;TSAI Benson |
| 分类号 |
B60K11/02 |
主分类号 |
B60K11/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat sink comprising:
a single-piece housing having a floor and two walls, the walls perpendicular to the floor, the walls parallel to each other; the housing having an inlet and an outlet; and the housing configured to attach power modules to an outer surface of the floor and to outer surfaces of the two walls, the housing configured to cool the power modules in response to fluid flow into the inlet. |
| 地址 |
Redwood City CA US |
