EPOXY COMPOSITION, ADHESIVE FILM, DICING DIE BONDING FILM, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy composition capable of maintaining excellent reliability and workability amidst semiconductor processes and of solving problems such as generations of bars, etc. by improving elasticity-related physical properties and an adhesive film, a dicing die bonding film, a semiconductor wafer, and a semiconductor device each including the same.SOLUTION: The provided epoxy composition consists of (a) a thermoplastic resin having an internally active structure or internally entwined structure, (b) an epoxy resin, and (c) a curative and satisfying the condition of X=5% to 20% (X expresses the gel content measured after the epoxy composition has been dried at a temperature of 110°C for 3 min).