发明名称 SUCTION MECHANISM AND SUCTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a suction mechanism and a suction device in which a substrate can be suction- held while the substrate is maintained as the predetermined posture without inclination.SOLUTION: A suction mechanism 10 for suction-holding a substrate by negative pressure comprises a cylinder shaft 31 through which a vent hole 311 for giving negative pressure that is for suction-holding the substrate in the shaft direction penetrates, a cylinder body 30 which contacts the substrate and comprises a suction pad 32 fitted to one edge side of the cylinder shaft 31, and a main body 20 into which the cylinder body 30 is inserted and which comprises a shaft insertion hole 22 that makes the cylinder body 30 movable depending on pressure. In the main body 20, a reference plane 26 which the substrate contacts and against which the substrate is kept as a predetermined posture at the contacting time is provided, the shaft insertion hole 22 is provided as opening in the reference plane 26, and at least the suction pad 32 is provided as capable of going in and out from the reference plane 26.
申请公布号 JP2014168838(A) 申请公布日期 2014.09.18
申请号 JP20130043086 申请日期 2013.03.05
申请人 HIOKI EE CORP 发明人 SHIMIZU MAKOTO
分类号 B25J15/06;H05K3/00 主分类号 B25J15/06
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