发明名称 FLEXIBLE PATTERN-ORIENTED 3D PROFILE FOR ADVANCED PROCESS NODES
摘要 The present disclosure relates to a method of RC extraction that provides for a fast development time and easy maintenance. In some embodiments, the method provides a graphical representation of an integrated chip layout having a plurality of integrated chip components. A plurality of pattern based graphical features are then determined. Respective pattern based graphical features define a structural aspect of an integrated chip component. One of the plurality of integrated chip components is defined as a pattern oriented function having inputs of one or more of the pattern based graphical features. The pattern oriented function determines a shape of the one of the plurality of integrated chip components based upon a relation between the plurality of inputs. By determining a shape of an integrated chip component using a pattern oriented function, the complexity of RC profiles can be reduced.
申请公布号 US2014282341(A1) 申请公布日期 2014.09.18
申请号 US201313906614 申请日期 2013.05.31
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Ho Chia-Ming;Liu Te-Yu;Chiang Austin Chingyu;Wu Meng-Fan;Su Ke-Ying
分类号 G06F17/50 主分类号 G06F17/50
代理机构 代理人
主权项 1. A method of generating an RC profile, comprising: generating a graphical representation of an integrated chip layout having a plurality of integrated chip components; determining a plurality of pattern based graphical features, wherein respective pattern based graphical features define a structural aspect of an integrated chip component; and defining one of the plurality of integrated chip components as a pattern oriented function having a plurality of inputs comprising one or more of the pattern based graphical features, wherein the pattern oriented function is configured to determine a shape of the one of the plurality of integrated chip components based upon a relation between the plurality of inputs.
地址 Hsin-Chu TW
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