发明名称 |
Contactless Fiber Optic Connector Assemblies |
摘要 |
A contactless connector module includes first and second fiber optic connector assemblies. The first fiber optic connector assembly includes a first fiber optic cable and a first connector provided at an end of the first fiber optic cable. The first connector includes a first converter converting between optical and electrical signals and a first communication chip electrically connected to the first converter. The first communication chip is configured to transmit wireless RF signals. The second fiber optic connector assembly includes a second fiber optic cable and a second connector provided at an end of the second fiber optic cable. The second connector includes a second converter converting between optical and electrical signals and a second communication chip electrically connected to the second converter. The second communication chip is configured to receive the wireless RF signals from the first communication chip. |
申请公布号 |
US2014270790(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201313870448 |
申请日期 |
2013.04.25 |
申请人 |
TYCO ELECTRONICS CORPORATION |
发明人 |
Copper Charles Dudley;McCarthy Sean Patrick;Bowen Terry Patrick |
分类号 |
H04B10/2575 |
主分类号 |
H04B10/2575 |
代理机构 |
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代理人 |
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主权项 |
1. A contactless connector module comprising:
a first fiber optic connector assembly having a first fiber optic cable and a first connector provided at an end of the first fiber optic cable, the first connector comprising a first converter converting between optical and electrical signals and a first communication chip electrically connected to the first converter, the first communication chip being configured to transmit wireless RF signals; and a second fiber optic connector assembly having a second fiber optic cable and a second connector provided at an end of the second fiber optic cable, the second connector comprising a second converter converting between optical and electrical signals and a second communication chip electrically connected to the second converter, the second communication chip being configured to receive the wireless RF signals from the first communication chip. |
地址 |
Berwyn PA US |