发明名称 |
POLISHING COMPOSITION AND POLISHING METHOD USING SAME, AND SUBSTRATE MANUFACTURING METHOD |
摘要 |
Provided is a polishing composition to be used for polishing an object including a conductor layer and an electrically conductive material layer that is in contact with the conductor layer. In a state in which the positive electrode and the negative electrode of an electrometer are connected to the electrically conductive material layer and the conductor layer, respectively, in the polishing composition at ordinary temperature, the current flowing from the positive electrode to the negative electrode has a positive value or is zero when the electrically conductive material layer and the conductor layer are polished. The polishing composition preferably contains a nitrogen atom-containing compound, a sulfur atom-containing compound, or a phosphorus atom-containing compound as an additive to control the value of the current to positive or zero. |
申请公布号 |
US2014263167(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201214355620 |
申请日期 |
2012.11.08 |
申请人 |
FUJIMI INCORPORATED |
发明人 |
Kachi Yoshihiro;Tanaka Tomoe;Umeda Takahiro |
分类号 |
H05K3/26;C09G1/02 |
主分类号 |
H05K3/26 |
代理机构 |
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代理人 |
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主权项 |
1. A polishing composition to be used for polishing an object including a conductor layer and an electrically conductive material layer that is in contact with the conductor layer,
wherein in a state in which a positive electrode and a negative electrode of an electrometer are connected to the electrically conductive material layer and the conductor layer, respectively, in the polishing composition at ordinary temperature, a current flowing from the positive electrode to the negative electrode has a positive value or is zero when the electrically conductive material layer and the conductor layer are polished. |
地址 |
Kyosu-shi, Aichi JP |