| 发明名称 |
MODULE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor. |
| 申请公布号 |
US2014262442(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414181036 |
申请日期 |
2014.02.14 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
Nomura Tadashi;Takagi Yoichi;Ogawa Nobuaki;Kamada Akihiko |
| 分类号 |
H05K1/02;H05K3/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A module comprising:
a circuit board; a resin layer disposed on a first principal surface of the circuit board; and an external connection conductor arranged in the resin layer, having a first end connected to the circuit board and a second end protruding through a surface of the resin layer, and including a projection extending along the surface of the resin layer in a portion protruding through the surface of the resin layer. |
| 地址 |
Kyoto-fu JP |
