发明名称 |
DATA LOGGER SENSOR COMPONENT ASSEMBLY AND TEST PROCESS |
摘要 |
An process for assembling a data logger for logging a sensed condition of an environment includes the steps of (1) reflow soldering a partially complete data logger printed circuit board; (2) assembling a sensor component to the printed circuit board via a molded socket that utilizes elastomeric contacts to cause an electrical connection between leads of the sensor component and the conductors on the printed circuit board; and (3) performing a sensor component specific post assembly process that results in the sensor component meeting a plurality of operational specifications, wherein the sensor component specific process takes less than two hours to complete. |
申请公布号 |
US2014259656(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201313837153 |
申请日期 |
2013.03.15 |
申请人 |
ONSET COMPUTER CORPORATION |
发明人 |
Lacourse Jacob |
分类号 |
H05K3/34;G01D15/00 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of assembling a data logger for logging a sensed condition of an environment, comprising:
processing a data logger printed circuit board comprising a portion of components other than a sensor component through a reflow soldering process; assembling a sensor component that is preconfigured to meet a plurality of operational specifications into a molded socket that utilizes elastomeric contacts to cause an electrical connection between leads of the sensor component and the conductors on the printed circuit board, providing a completed printed circuit board assembly; and performing a post-reflow process on the completed printed circuit board assembly that includes a sensor component specific process that results in the sensor component meeting the plurality of operational specifications, wherein the sensor component specific process takes less than two hours to complete. |
地址 |
Bourne MA US |