发明名称 |
PHOTONIC MULTI-CHIP MODULE |
摘要 |
<p>The subject matter disclosed herein relates to a photonic module comprising: a plurality of metal pads to receive CMOS integrated circuit (IC) chips to be mounted on a silicon-on-insulator (SOI) wafer; electrical interface circuits to receive electrical signals from the CMOS IC chips and to modify the electrical signals; optical drivers to receive the modified electrical signals and to convert the modified electrical signals to optical signals; and a photonic layer on the SOI wafer comprising silicon optical waveguides and silica optical waveguides to transmit or receive the optical signals for communication among the CMOS IC chips.</p> |
申请公布号 |
WO2014144590(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
WO2014US29065 |
申请日期 |
2014.03.14 |
申请人 |
APIC CORPORATION |
发明人 |
DUTT, BIRENDRA;KAPOOR, ASHOK KUMAR |
分类号 |
G02B6/43;G02B6/12;H01L27/06;H05K1/02 |
主分类号 |
G02B6/43 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|