| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device with high design flexibility.SOLUTION: A semiconductor device 10 comprises: a semiconductor chip 14 including a transistor; a chip mounting substrate 12 having a chip mounting surface 12a on which the semiconductor chip 14 is mounted; and a first wiring board 22 provided on the semiconductor chip 14. The first wiring board 22 comprises a first insulating substrate, and a first conductive layer provided on the first insulating substrate and electrically connected to the transistor.</p> |
