Method of manufacturing Multilayer Piezoelectric Devices

摘要

A process that permits existing thick film printing technology to be utilized with existing conductive adhesives to form multi-layer dielectric devices, more specifically to form multi-layer ferroelectric devices, and more specifically to form multilayer piezoelectric devices. A conductive paste is applied to a first surface of a piezoelectric element in a desired pattern. The disclosed process utilizes conductive paste, which replaces the usual adhesive requirement for bonding while still acting as the conductive layer between the individual elements of the stacked sintered substrates. An isolating filler paste is applied to the first surface of the piezoelectric element in a manner that electrically isolates the conductive pattern as to enable multiple distinct, possibly unequal, regions of electric potential. This paste also may assist bonding and will prevent shorting between the electrically non-equivalent regions of the overall electrode pattern. Multiple substrates are stacked, dried and fired as described herein to form multilayer piezoelectric devices.

主权项

1. A method of manufacturing a multilayer piezoelectric device comprising:
forming a pattern of conductive paste on a surface of a first piezoelectric element; applying isolating filler paste to the surface of the first piezoelectric element in a complementary pattern to the pattern of conductive paste such that substantially all of a surface area of the first piezoelectric element is covered by the isolating filler and the conductive paste; drying the first piezoelectric element with the applied isolating filler paste and the conductive filler paste; stacking a second piezoelectric element onto the first piezoelectric element such that a blank surface of the second piezoelectric element contacts the dried filler paste and dried conductive paste of the first piezoelectric element thereby forming a stacked structure; firing the stacked structure for a sufficient time at a firing temperature sufficient to evaporate carriers and plasticizers present in the isolating and conductive pastes; and polarizing the stacked structure.