Semiconductor Device and Method of Calibrating Warpage Testing System to Accurately Measure Semiconductor Package Warpage

摘要

A warpage test system uses a calibration block to calibrate the warpage test system over a temperature profile. The calibration block includes a first metal block bonded to a second metal block. The first metal block includes a first metal and a second different metal. The first metal block includes a CTE different than a CTE of the second metal block. The calibration block is disposed in the warpage test system. A warpage of the calibration block is measured over a temperature profile ranging from 28° C. to 260° C. A deviation between the measured warpage of the calibration block and a known thermal expansion of the calibration block over the temperature profile is recorded. The warpage measurement in a semiconductor package is compensated by the deviation between the measured warpage of the calibration block and the known thermal expansion or warpage of the calibration block over the temperature profile.

主权项

1. A method of calibrating a warpage test system, comprising:
providing a calibration block including a first metal block bonded to a second metal block, wherein the first metal block includes a coefficient of thermal expansion (CTE) different than a CTE of the second metal block; disposing the calibration block in the warpage test system; measuring warpage of the calibration block over a temperature profile; and recording a deviation between the measured warpage of the calibration block and a known thermal expansion of the calibration block over the temperature profile.