| 发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL |
| 摘要 |
A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process. |
| 申请公布号 |
US2014259640(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313804857 |
申请日期 |
2013.03.14 |
| 申请人 |
SUMIDA CORPORATION |
发明人 |
SAKAMOTO Shinichi;MALCOLM Douglas James |
| 分类号 |
H01F41/06 |
主分类号 |
H01F41/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing an electronic component comprising:
placing a T-shaped core and an air-core coil in a mold; injecting a mixture of a composite magnetic material and a resin into the mold so that the T-shaped core and the air-core coil are embedded by the mixture; heating the mixture at a first temperature; adjusting an outer shape while removing excessive mixture, and hardening the mixture. |
| 地址 |
Tokyo JP |
