发明名称 CAMERA MODULE
摘要 PROBLEM TO BE SOLVED: To provide a camera module which is capable of avoiding a functional failure caused by the deformation of a surface to which an imaging element is attached in an insulation part as much as possible.SOLUTION: In the camera module, a planar part 13b2 for suppressing the deformation of the surface to which an imaging element 15 is attached in a second insulation part 13 is buried in the second insulation part 13 of a substrate 10, so as to face the imaging element 15 attached to the surface (upper surface) of the second insulation part 13.
申请公布号 JP2014170183(A) 申请公布日期 2014.09.18
申请号 JP20130043085 申请日期 2013.03.05
申请人 TAIYO YUDEN CO LTD 发明人 MIYAZAKI MASASHI;SUGIYAMA YUICHI;SARUWATARI TATSURO;YOKOTA HIDEKI;HATA YUTAKA
分类号 G03B17/02;G02B7/02;H01L27/14;H04N5/225;H04N5/335 主分类号 G03B17/02
代理机构 代理人
主权项
地址