发明名称 |
METHOD FOR MANUFACTURING PIEZOELECTRIC DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric device capable of preventing a poor contact between a pair of lead terminals of a piezoelectric vibrator and a substrate.SOLUTION: A method for manufacturing a piezoelectric device comprises the steps of: coating a case region corresponding to a metal case and a lead region corresponding to a third portion with a cream solder on a surface of a substrate (S102); installing a block solder having a smaller area than the case region in the case region (S103); arranging a metal case of a piezoelectric vibrator in the case region and the third portion in the lead region (S104); and heating the substrate and the piezoelectric vibrator in a reflow furnace (S105). A lead terminal includes a first portion pulled out horizontally in a longitudinal direction of the metal case, a second portion bent vertically in the longitudinal direction, and a third portion rebent in the longitudinal direction.</p> |
申请公布号 |
JP2014171183(A) |
申请公布日期 |
2014.09.18 |
申请号 |
JP20130043097 |
申请日期 |
2013.03.05 |
申请人 |
NIPPON DEMPA KOGYO CO LTD |
发明人 |
UCHIDA TAKASHI;YOSHIMURA TAKAHIRO |
分类号 |
H03H3/02;H01L23/04 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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