| 发明名称 |
Package-on-Package with Via on Pad Connections |
| 摘要 |
An interposer includes a core dielectric material, a conductive pipe penetrating through the core dielectric material, and a metal pad underlying the conductive pipe. The metal pad includes a center portion overlapped by a region encircled by the conductive pipe, and an outer portion in contact with the conductive pipe. A dielectric layer is underlying the core dielectric material and the metal pad. A via is in the dielectric layer, wherein the via is in physical contact with the center portion of the metal pad. |
| 申请公布号 |
US2014264857(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414157745 |
申请日期 |
2014.01.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wu Jiun Yi |
| 分类号 |
H01L25/065;H01L21/56;H05K1/11;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An interposer comprising:
a core dielectric material; a conductive pipe penetrating through the core dielectric material; a metal pad underlying the conductive pipe, wherein the metal pad comprises:
a center portion overlapped by a region encircled by the conductive pipe; andan outer portion in contact with the conductive pipe; a dielectric layer underlying the core dielectric material and the metal pad; and a via in the dielectric layer, wherein the via is in physical contact with the center portion of the metal pad. |
| 地址 |
Hsin-Chu TW |
