SEALANT LAMINATED COMPOSITE, SEALED SEMICONDUCTOR DEVICES MOUNTING SUBSTRATE, SEALED SEMICONDUCTOR DEVICES FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

摘要

Disclosed is a sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices may be mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices may be formed, including a support wafer that may be composed of silicon and an uncured resin layer that may be constituted of an uncured thermosetting resin formed on one side of the support wafer.

主权项

1. A sealant laminated composite for collectively sealing a semiconductor devices mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor devices forming surface of a wafer on which semiconductor devices are formed, comprising:
a support wafer composed of silicon; and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer.