INTERLAYER CONDUCTOR STRUCTURE AND METHOD

摘要

To form an interconnect conductor structure, a stack of pads, coupled to respective active layers of a circuit, is formed. Rows of interlayer conductors are formed to extend in an X direction in contact with landing areas on corresponding pads in the stack. Adjacent rows are separated from one another in a Y direction generally perpendicular to the X direction. The interlayer conductors in a row have a first pitch in the X direction. The interlayer conductors in adjacent rows are offset in the X direction by an amount less than the first pitch. Interconnect conductors are formed over and in contact with interlayer conductors. The interconnect conductors extend in the Y direction and have a second pitch less than the first pitch.

主权项

1. A method of forming an interconnect conductor structure, comprising:
forming a stack of pads coupled to respective active layers of a circuit; forming interlayer conductors arranged in rows extending in an X direction in contact with landing areas on corresponding pads in the stack, adjacent rows being separated from one another in a Y direction generally perpendicular to the X direction, the interlayer conductors in a row having a first pitch in the X direction, and the interlayer conductors in adjacent rows being offset in the X direction by an amount less than the first pitch; and forming interconnect conductors over and in contact with interlayer conductors, the interconnect conductors extending in the Y direction and having a second pitch less than the first pitch.