| 发明名称 |
Fan-Out Interconnect Structure and Method for Forming Same |
| 摘要 |
A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached to a carrier, and a molding compound is formed over the die and the sacrificial film layer. The molding compound extends along sidewalls of the die. The sacrificial film layer is exposed. The contact pad is exposed by removing at least a portion of the sacrificial film layer. A first polymer layer is formed over the die, and a redistribution layer (RDL) is formed over the die and electrically connects to the contact pad. |
| 申请公布号 |
US2014264930(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313937726 |
申请日期 |
2013.07.09 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Hu Yen-Chang;Hsiao Ching-Wen;Lii Mirng-Ji;Liu Chung-Shi;Hwang Chien Ling;Lin Chih-Wei;Chen Chen-Shien |
| 分类号 |
H01L23/48;H01L21/50 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for integrated circuit packaging comprising:
forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface; attaching the die to a carrier; forming a molding compound over the die and the sacrificial film layer, the molding compound extending along sidewalls of the die; exposing the sacrificial film layer; exposing the contact pad by removing at least a portion of the sacrificial film layer; forming a first polymer layer over the die; and forming a redistribution layer (RDL) over the die and electrically connected to the contact pad. |
| 地址 |
Hsin-Chu TW |
