| 发明名称 |
INTERCONNECT STRUCTURES WITH POLYMER CORE |
| 摘要 |
Embodiments of the present disclosure are directed towards techniques and configurations of interconnect structures having a polymer core in integrated circuit (IC) package assemblies. In one embodiment, an apparatus includes a first die having a plurality of transistor devices disposed on an active side of the first die and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have a polymer core, and an electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. Other embodiments may be described and/or claimed. |
| 申请公布号 |
US2014264910(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313829483 |
申请日期 |
2013.03.14 |
| 申请人 |
Razdan Sandeep;Prack Edward R.;Agraharam Sairam;Sankman Robert L.;Zhong Shan;Nickerson Robert M. |
发明人 |
Razdan Sandeep;Prack Edward R.;Agraharam Sairam;Sankman Robert L.;Zhong Shan;Nickerson Robert M. |
| 分类号 |
H01L25/065;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a first die having a plurality of transistor devices disposed on an active side of the first die; and a plurality of interconnect structures electrically coupled with the first die, wherein individual interconnect structures of the plurality of interconnect structures have
a polymer core, andan electrically conductive material disposed on the polymer core, the electrically conductive material being configured to route electrical signals between the transistor devices of the first die and a second die. |
| 地址 |
Chandler AZ US |
