发明名称 |
METHOD FOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS |
摘要 |
A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump. |
申请公布号 |
US2014264852(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201414291749 |
申请日期 |
2014.05.30 |
申请人 |
STMicroelectronics S.r.l. ;POLITECNICO DI MILANO |
发明人 |
Vanalli Gian Pietro;Campardo Giovanni;Losavio Aldo;Pulici Paolo;Stoppino Pier Paolo |
分类号 |
H01L23/00;H01L23/498 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Agrate Brianza (MB) IT |