发明名称 |
BUMPLESS BUILD-UP LAYER (BBUL) SEMICONDUCTOR PACKAGE WITH ULTRA-THIN DIELECTRIC LAYER |
摘要 |
Bumpless build-up layer (BBUL) semiconductor packages with ultra-thin dielectric layers are described. For example, an apparatus includes a semiconductor die including an integrated circuit having a plurality of external conductive bumps. A semiconductor package houses the semiconductor die. The semiconductor package includes a dielectric layer disposed above the plurality of external conductive bumps. A conductive via is disposed in the dielectric layer and coupled to one of the plurality of conductive bumps. A conductive line is disposed on the dielectric layer and coupled to the conductive via. |
申请公布号 |
US2014264830(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201313801859 |
申请日期 |
2013.03.13 |
申请人 |
Teh Weng Hong;Davies-Venn Emile;Andideh Ebrahim;Raorane Digvijay A.;Sobieski Daniel N. |
发明人 |
Teh Weng Hong;Davies-Venn Emile;Andideh Ebrahim;Raorane Digvijay A.;Sobieski Daniel N. |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus, comprising:
a semiconductor die comprising an integrated circuit having a plurality of external conductive bumps; and a semiconductor package housing the semiconductor die, the semiconductor package comprising a dielectric layer disposed above the plurality of external conductive bumps, a conductive via disposed in the dielectric layer and coupled to one of the plurality of conductive bumps, and a conductive line disposed on the dielectric layer and coupled to the conductive via. |
地址 |
Phoenix AZ US |