PACKAGE DEVICE INCLUDING AN OPENING IN A FLEXIBLE SUBSTRATE AND METHODS OF FORMING THE SAME

摘要

Methods and apparatus are disclosed for forming ultra-thin packages for semiconductor devices on flexible substrates. A flexible substrate may comprise a plurality of insulating layers and redistribution layers. Openings of the flexible substrate may be formed at one side of the flexible substrate, two sides of the flexible substrate, or simply cut through the flexible substrate to divide the flexible substrate into two parts. Connectors may be placed within the opening of the flexible substrate and connected to redistribution layers of the flexible substrate. Dies can be attached to the connectors and electrically connected to the connectors and to the redistribution layers of the flexible substrate. Structure supports may be placed at another side of the flexible substrate on the surface or within an opening.

主权项

1. A package device, comprising:
a flexible substrate, wherein the flexible substrate comprises a first insulating layer, a first redistribution layer on the first insulating layer at a first side, a second insulating layer on the first redistribution layer; a first opening of the flexible substrate through the second insulating layer and separating the second insulating layer into a first portion and a second portion; one or more connectors placed within the first opening of the flexible substrate and in contact with the first redistribution layer; and a die on the one or more connectors and electrically connected to the one or more connectors.