NO-EXPOSED-PAD QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

摘要

A quad flat no-lead (QFN) packaging structure. The QFN packaging structure includes a metal substrate, a first die coupled to a top surface of the metal substrate, and a plurality of I/O pads formed on the metal substrate, and extending to the proximity of the die. The no-exposed-pad QFN packaging structure also includes a first metal layer containing a plurality of inner leads corresponding to the plurality of I/O pads and extending to proximity of the die and is formed on the metal substrate by a multi-layer electrical plating process. Further, the no-exposed-pad QFN packaging structure includes metal wires connecting the die and the plurality of inner leads, and a second metal layer formed on a back surface of the plurality of I/O pads.

主权项

1. A no-exposed-pad quad flat no-lead (QFN) packaging structure, comprising:
a) a metal substrate; b) a first die coupled to a top surface of the metal substrate; c) a plurality of I/O pads formed on the metal substrate; d) a first metal layer, containing a plurality of inner leads corresponding to the plurality of I/O pads and extending to proximity of the die, the first metal layer being formed on the metal substrate; e) metal wires connecting the die and the plurality of inner leads; and f) a second metal layer formed on a back surface of the plurality of I/O pads, wherein the die, the plurality of inner leads, and the metal wires are sealed with a molding compound.