| 发明名称 |
COMPONENT-EMBEDDED SUBSTRATE |
| 摘要 |
A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, with the bumps on the surface-mount component located 50 μm or more from the outline of the internal component. |
| 申请公布号 |
US2014264737(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201414289938 |
申请日期 |
2014.05.29 |
| 申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
GOUCHI Naoki |
| 分类号 |
H01L49/02;H01L23/66 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A component-embedded substrate comprising:
a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction; an internal component provided in the multilayer substrate; and a surface-mount component mounted on a surface of the multilayer substrate using bumps, wherein, the surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, with the bumps on the surface-mount component located 50 μm or more from the outline of the internal component. |
| 地址 |
Kyoto-fu JP |
