SEMICONDUCTOR WAFER, SEMICONDUCTOR PROCESS AND SEMICONDUCTOR PACKAGE

摘要

The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of dielectric layers. The semiconductor wafer is defined as a plurality of die areas and a plurality of trench areas, each of the die areas has an integrated circuit including a plurality of patterned metal layers disposed between the dielectric layers. The trench areas are disposed between the die areas, and the at least one metal segment is disposed in the trench area and insulated from the integrated circuit of the die area.

主权项

1. A semiconductor package, comprising:
a semiconductor die, comprising:
a substrate;
a plurality of dielectric layers, disposed on the substrate;an integrated circuit, including a plurality of patterned metal layers disposed between the dielectric layers and electrically connected to each other; andat least one metal segment, insulated from the integrated circuit and exposed from a lateral side surface of the semiconductor die.