PACKAGING MECHANISMS FOR DIES WITH DIFFERENT SIZES OF CONNECTORS

摘要

Embodiments of mechanisms for testing a die package with multiple packaged dies on a package substrate use an interconnect substrate to provide electrical connections between dies and the package substrate and to provide probing structures (or pads). Testing structures, including daisy-chain structures, with metal lines to connect bonding structures connected to signals, power source, and/or grounding structures are connected to probing structures on the interconnect substrate. The testing structures enable determining the quality of bonding and/or functionalities of packaged dies bonded. After electrical testing is completed, the metal lines connecting the probing structures and the bonding structures are severed to allow proper function of devices in the die package. The mechanisms for forming test structures with probing pads on interconnect substrate and severing connecting metal lines after testing could reduce manufacturing cost.

主权项

1. A semiconductor die package, comprising:
a first packaged die; an interconnect substrate with a redistribution structure, wherein the first packaged die is bonded to the redistribution structure, wherein the interconnect substrate includes a plurality of probing pads whose electrical connections to the first packaged die are severed; and a package substrate with an interconnect structure, wherein the interconnect substrate is bonded to the package substrate, and wherein the package substrate is electrically connected to the first packaged die.