| 发明名称 |
RFID Inlay Incorporating a Ground Plane |
| 摘要 |
An RFID inlay. The RFID inlay can include a substrate having a first area and a second area, a conductive structure having a first part disposed over at least a portion of the first area and a second part disposed over at least a portion of the second area, and a dielectric material disposed over at least a portion of the conductive structure, wherein the substrate is adapted to be folded such that the first part of the conductive structure is disposed over the second part of the conductive structure and the dielectric material is disposed between the first part and the second part. |
| 申请公布号 |
US2014263655(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
US201313798557 |
申请日期 |
2013.03.13 |
| 申请人 |
AVERY DENNISON CORPORATION |
发明人 |
FORSTER Ian J. |
| 分类号 |
G06K19/077 |
主分类号 |
G06K19/077 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An RFID inlay, comprising:
a substrate having a first area and a second area; a conductive structure having a first part disposed over at least a portion of the first area and a second part disposed over at least a portion of the second area; and a dielectric material disposed over at least a portion of the conductive structure; wherein the substrate is adapted to be folded such that the first part of the conductive structure is disposed over the second part of the conductive structure and the dielectric material is disposed between the first part and the second part. |
| 地址 |
Pasadena CA US |
