发明名称 |
INTEGRATED CLUSTER TO ENABLE NEXT GENERATION INTERCONNECT |
摘要 |
Embodiments of the present invention generally relate to methods for forming a metal structure and passivation layers. In one embodiment, metal columns are formed on a substrate. The metal columns are doped with manganese, aluminum, zirconium, or hafnium. A dielectric material is deposited over and between the metal columns and then cured to form a passivation layer on vertical surfaces of the metal columns. |
申请公布号 |
US2014273430(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201414180098 |
申请日期 |
2014.02.13 |
申请人 |
Applied Materials, Inc. |
发明人 |
NAIK Mehul B.;Mallick Abhijit Basu;Thadani Kiran V.;Cui Zhenjiang |
分类号 |
H01L21/768;H01L21/56 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming passivation layers, comprising:
forming metal columns over a substrate, wherein each metal column is doped with manganese, aluminum, zirconium, or hafnium; depositing a dielectric material between and over the metal columns; and curing the dielectric material to form a passivation layer on vertical surfaces of the metal columns. |
地址 |
Santa Clara CA US |