| 发明名称 |
ELECTRONIC SUB-ASSEMBLY AND METHOD FOR THE PRODUCTION OF AN ELECTRONIC SUB-ASSEMBLY |
| 摘要 |
The invention relates to an electronic sub-assembly (36) having at least one electronic component (14) embedded in a sequence of layers, the electronic component(14) being arranged in a recess of an electrically conducting central layer (16) and directly adjoining a resin layer (12, 20) on each side. |
| 申请公布号 |
WO2014139674(A1) |
申请公布日期 |
2014.09.18 |
| 申请号 |
WO2014EP00653 |
申请日期 |
2014.03.12 |
| 申请人 |
SCHWEIZER ELECTRONIC AG |
发明人 |
GOTTWALD, THOMAS;NEUMANN, ALEXANDER |
| 分类号 |
H01L21/60;H01L23/538;H01L25/07 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
