发明名称 |
HEAT INSULATION MATERIAL FOR FLOOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat insulation material 10A for a floor, which has a depressed area 12 and a through-hole 13 and which can simplify work for wiping off rainwater retained in a peripheral side frame 11.SOLUTION: A heat insulation material 10A for a floor includes a rectangular outer frame 11 and an appropriate number of depressed areas 12 depressed downward from a top surface of the outer frame 11. A through-hole 13 is formed in the lowermost part of the depressed area 12. The heat insulation material 10A for the floor is made of a resin foam. An appropriate number of second through-holes 16 are formed in the outer frame 11. |
申请公布号 |
JP2014169603(A) |
申请公布日期 |
2014.09.18 |
申请号 |
JP20130043238 |
申请日期 |
2013.03.05 |
申请人 |
SUMITOMO FORESTRY CO LTD;SHIBA SANGYO KK;SEKISUI PLASTICS CO LTD |
发明人 |
MURAMATSU GO;SHIBA TOMOYOSHI;FUJIMOTO YUSUKE;MACHIDA MAKOTO |
分类号 |
E04B1/80 |
主分类号 |
E04B1/80 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|