发明名称 HEAT INSULATION MATERIAL FOR FLOOR
摘要 PROBLEM TO BE SOLVED: To provide a heat insulation material 10A for a floor, which has a depressed area 12 and a through-hole 13 and which can simplify work for wiping off rainwater retained in a peripheral side frame 11.SOLUTION: A heat insulation material 10A for a floor includes a rectangular outer frame 11 and an appropriate number of depressed areas 12 depressed downward from a top surface of the outer frame 11. A through-hole 13 is formed in the lowermost part of the depressed area 12. The heat insulation material 10A for the floor is made of a resin foam. An appropriate number of second through-holes 16 are formed in the outer frame 11.
申请公布号 JP2014169603(A) 申请公布日期 2014.09.18
申请号 JP20130043238 申请日期 2013.03.05
申请人 SUMITOMO FORESTRY CO LTD;SHIBA SANGYO KK;SEKISUI PLASTICS CO LTD 发明人 MURAMATSU GO;SHIBA TOMOYOSHI;FUJIMOTO YUSUKE;MACHIDA MAKOTO
分类号 E04B1/80 主分类号 E04B1/80
代理机构 代理人
主权项
地址