WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE WITHOUT USING A LEAD FRAME AND METHOD OF MANUFACTURING THE SAME

摘要

A winding-type solid electrolytic capacitor package structure without using any lead frame includes a winding capacitor and a package body. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body. The positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body and extended along the first lateral surface and the bottom surface of the package body. The negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body and extended along the second lateral surface and the bottom surface of the package body.

主权项

1. A winding-type solid electrolytic capacitor package structure without using a lead frame, comprising:
a capacitor unit including at least one winding capacitor, wherein the at least one winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body; and a package unit including a package body for enclosing the winding body, wherein the package body has a first lateral surface, a second lateral surface opposite to the first lateral surface, and a bottom surface connected between the first lateral surface and the second lateral surface; wherein the positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion connected with the first embedded portion and exposed outside the package body, and the first exposed portion is extended along the first lateral surface and the bottom surface of the package body; wherein the negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion connected with the second embedded portion and exposed outside the package body, and the second exposed portion is extended along the second lateral surface and the bottom surface of the package body.