MICROELECTROMECHANICAL SYSTEM DEVICES HAVING THROUGH SUBSTRATE VIAS AND METHODS FOR THE FABRICATION THEREOF

摘要

Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) devices are provided, as are MEMS devices. In one embodiment, the MEMS device fabrication method includes forming at least one via opening extending into a substrate wafer, depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via, bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer, and forming an electrical connection between the via and the electrically-conductive transducer layer. The substrate wafer is thinned to reveal the via through a bottom surface of the substrate wafer, and a backside conductor is produced over a bottom surface of the substrate wafer electrically coupled to the via.

主权项

1. A method of fabricating of a Microelectromechanical Systems (“MEMS”) device, comprising:
forming at least one via opening extending into a substrate wafer; depositing a body of electrically-conductive material over the substrate wafer and into the via opening to produce a via; bonding the substrate wafer to a transducer wafer having an electrically-conductive transducer layer; forming an electrical connection between the via and the electrically-conductive transducer layer; thinning the substrate wafer to reveal the via through a bottom surface of the substrate wafer; and after thinning the substrate wafer, producing a backside conductor over the bottom surface of the substrate wafer electrically coupled to the via.