发明名称 |
NOVEL STRUCTURE OF METAL GATE MIM |
摘要 |
First and second multi-layer structures are formed within respective openings in at least one dielectric layer formed over a semiconductor substrate. The first multi-layer structure comprises a gate electrode, and the second multi-layer structure comprises a resistor and a first electrode of a metal-insulator-metal (MIM) capacitor structure. The MIM capacitor structure is completed by forming a dielectric film on the at least one dielectric layer and forming a second electrode on the dielectric film. |
申请公布号 |
US2014264743(A1) |
申请公布日期 |
2014.09.18 |
申请号 |
US201313905856 |
申请日期 |
2013.05.30 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yen Hsiu-Jung;Wang Jen-Pan |
分类号 |
H01L49/02 |
主分类号 |
H01L49/02 |
代理机构 |
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代理人 |
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主权项 |
1. A method, comprising:
forming first and second multi-layer structures within respective openings in at least one dielectric layer formed over a semiconductor substrate, wherein the first multi-layer structure comprises a gate electrode, and wherein the second multi-layer structure comprises a resistor and a first electrode of a metal-insulator-metal (MIM) capacitor structure; and completing the MIM capacitor structure by:
forming a dielectric film on the first multi-layer structure, the second multi-layer structure, and the at least one dielectric layer; andforming a second electrode on the dielectric film. |
地址 |
Hsin-Chu TW |