发明名称 NOVEL STRUCTURE OF METAL GATE MIM
摘要 First and second multi-layer structures are formed within respective openings in at least one dielectric layer formed over a semiconductor substrate. The first multi-layer structure comprises a gate electrode, and the second multi-layer structure comprises a resistor and a first electrode of a metal-insulator-metal (MIM) capacitor structure. The MIM capacitor structure is completed by forming a dielectric film on the at least one dielectric layer and forming a second electrode on the dielectric film.
申请公布号 US2014264743(A1) 申请公布日期 2014.09.18
申请号 US201313905856 申请日期 2013.05.30
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Yen Hsiu-Jung;Wang Jen-Pan
分类号 H01L49/02 主分类号 H01L49/02
代理机构 代理人
主权项 1. A method, comprising: forming first and second multi-layer structures within respective openings in at least one dielectric layer formed over a semiconductor substrate, wherein the first multi-layer structure comprises a gate electrode, and wherein the second multi-layer structure comprises a resistor and a first electrode of a metal-insulator-metal (MIM) capacitor structure; and completing the MIM capacitor structure by: forming a dielectric film on the first multi-layer structure, the second multi-layer structure, and the at least one dielectric layer; andforming a second electrode on the dielectric film.
地址 Hsin-Chu TW