WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

A wiring substrate includes, an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate, a first connection pad arranged on one face of the insulating substrate, a second connection pad arranged to correspond to the first connection pad on other face of the insulating substrate, a first metal layer arranged to surround the first connection pad, a second metal layer arranged to correspond to the first metal layer, the second metal layer surrounding the second connection pad, the plurality of penetration conductors connecting the first connection pad and the second connection pad, and connecting the first metal layer and the second metal layer, and an elastic body formed in a part of the insulating substrate between the first and second connection pads, and the first and second metal layers.

主权项

1. A wiring substrate, comprising:
an insulating substrate in which a plurality of penetration conductors are provided, the penetration conductors penetrating in a thickness direction of the insulating substrate; a first connection pad arranged on one face of the insulating substrate; a second connection pad arranged to correspond to the first connection pad on the other face of the insulating substrate; a first metal layer arranged to surround the first connection pad; a second metal layer arranged to correspond to first metal layer, the second metal layer surrounding the second connection pad; the plurality of penetration conductors connecting the first connection pad and the second connection pad, and connecting the first metal layer and the second metal layer; and an elastic body formed in a part of the insulating substrate between a region where the first connection pad and second connection pad are arranged, and a region where the first metal layer and second metal layer are arranged.